专利名称：Mounting apparatus发明人：Adam Gold,Wayne Chen申请号：US12931797申请日：20110208公开号：US08556143B2公开日：20131015
专利附图：
摘要：A mounting assembly for interconnecting a first object and a second object hasa link assembly having a first end that couples the first object, and a second end thatcouples the second object, and a top plate assembly pivotably coupled to the secondend of the link assembly. The top plate assembly includes an upper plate having a
plurality of holes for attachment to a receiving device, and a lower plate pivotablycoupled to the second end of the link assembly. The lower plate is connected to theupper plate only through a plurality of shock and vibration absorption members, therebyimproving the shock and vibration absorption effect.
申请人：Adam Gold,Wayne Chen
地址：Scarsdale NY US,Los Angeles CA US
国籍：US,US
代理人：Raymond Sun
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容