专利名称：Electrical Contact Conductivity Via Surface
Doping
发明人：John K. CHAN,Gary Charles SIBILANT,Jy-An
WANG,Fei REN
申请号：US14087407申请日：20131122
公开号：US20140151117A1公开日：20140605
专利附图：
摘要：An electrical connector for connecting electrical power transmission lines isprovided. The electrical connector is capable of conducting 1×10to 2.5×10siemens per
meter squared (S/m), and includes a base metal having a surface layer doped with aconductive material dopant. The conductive dopant material improves the reliability andperformance of the electrical connector. An electrical power transmission systemincluding electrical power transmission lines connected by the electrical connector, and amethod of joining power transmission lines with the electrical connector are alsodisclosed.
申请人：Electric Power Research Institute, Inc.
地址：Palo Alto CA US
国籍：US
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