专利名称：Method for producing printed wiring boards发明人：Masahide Tsukamoto,Masanaru
Hasegawa,Hideo Hatanaka
申请号：US10762004申请日：20040121公开号：US07059039B2公开日：20060613
专利附图：
摘要：A method for producing printed wiring boards comprises the steps ofperforating through holes at predetermined positions in an adhesive insulator sheet,filling the through holes with a conductive material such as a conductive paste or metal
balls, transferring conductive wiring patterns that have been formed on surfaces ofreleasable supporting sheets onto the surfaces of the adhesive insulator sheet by heatand pressure. Simultaneously, interlayer via-connections are performed by means of theconductive material filled into the through holes.
申请人：Masahide Tsukamoto,Masanaru Hasegawa,Hideo Hatanaka
地址：Nara JP,Yawata JP,Katano JP
国籍：JP,JP,JP
代理机构：Hamre, Schumann, Mueller & Larson, P.C.
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